Home > Products > EDA > Package Solution
Package Solution
HERMES SI – Package and Board level signal integrity analysis


Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity plays an important role in the high speed channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity, but there are many defects in the traditional 3D full-wave simulation, for example, the model creation is complex and time-consuming.

Product Introduction

HERMES SI is an application which use three-dimensional full-wave EM simulation to deal with high-speed serial circuit. It provides a fast and accurate import brd models, check the signal integrity metrics such as insertion loss, return loss, and crosstalk; it also allows designer to perform simulation and track processing for the post-layout model.
HERMES SI supports following main features:

  • Optimized mesh algorithm improves simulation speed and precision

  • Fast 3D FEM solver provides high-precision, high-quality solution

  • Hybrid solver provides high-speed solution, performance is higher than similar products in market

  • Support import brd model

  • Manually add port, analysis setting

  • The 3D view function makes the model checking more easily and visually

  • Support export result to HFSS and CTS


  • Built-in full wave FEM3D solver and Hybrid solver.

  • Automatic port generation simplifies EM analysis setup.

  • Seamlessly link to SnpExpert for S-parameter viewing and post-processing.

Main Features

  • The FEM3D solver provides high-precision, high-quality simulation results. While the Hybrid solver focuses on simulation speed and provides a solution for rapid analysis

  • Optimization mesh improves the simulation accuracy and speed

  • Support PCB and package Co-simulation

  • Support to create and edit Bondwire, Solder ball

  • Support material library and padstack library management

  • Support the latest tabbed routing template for quick modeling

  • Support to import ODB++ , IPC-2581, Allegro brd\mcm\sip, PADS ASC file

  • 3D-View makes the model check easier

  • Add a recent project management panel to achieve a quick preview of recent projects

  • Support to quickly edit trace and padstack

  • Support cutting a smaller rectangler or polygonal area by for analysis , reducing simulation scale

  • Support export models to third-party tools, such as HFSS or CST


Thank you for your attention to the products and technology of Xpeedic.  Please let us know if you have any general enquiries or feedback.