IRIS Plus provides a separate 3D EM simulation tool, also support import IRIS project file, GDS file, and integrated serpentine routing model, RFIC model and RFPCB model, let designer can do the EM simulation quickly.
Support import IRIS project file modeling
Support import GDS file modeling
Support serpentine routing model modeling
Support RFIC modeling
Support RFPCB modeling
Support import Allegro RFPCB component with one click
Support stackup setting by layer
Support mesh size setting based on frequency
Auto port searching simplifies EM setup
Support metal 3D model to capture sidewall effect, and make it suitable for 45nm technology and below
Support metal-slot removal option to improve simulation speed
Introduce multi-threading technology to Green’s Function, greatly improve the database creation efficiency
Optimized mesh to balance speed and accuracy, support rectangle and triangle mixed mesh to improve simulation speed.
Auto via array disfeaturing when generate mesh file.
Support 3D model display
Support parallel processing techniques, especially for multi-threading processing.
Support batch simulation when multiple simulation jobs exist.
Support EM simulation results back-annotation.
Support export IRIS Plus model to HFSS with one click.
Accelerated MOM solution simulate complex electromagnetic environment including skin effect, proximity effect and multilayer dielectric losses.
Support modeling by import IRIS, GDS, ODB++, dxf, dwg file
Easy export to HFSS.
Standalone 3D EM simulation tool for RFIC, MMIC, Module, Package, RF PCB and interconnect
Auto port searching and setting, simplifies EM setup
Build-in lots of RF/Microwave passive component template
Support parametric and optimization sweep simulation
Support multicore parallelization calculation and distributed processing
Support to use multithreading technology to create Green's functions
Support optimized rectangle-triangle mixed mesh result in mesh element ● reduction and mesh regularization
Support adaptive mesh，auto defined metal model (sheet, thick, 3D), auto defined mesh size based on model physical size
Optimized via's setup and improve simulation speed
Support model 3D display, provide zoom in, zoom out, move and other operations
Multiple simulation jobs for batch run
Support to export model to GDS/DXF
Display current density in 3D view
What's New in IRIS Plus 2019.01
Improve MOM Solver simulation efficiency with 1.7 speedup, and reduce memory consumption by 52%
Parse component information to IRIS Plus when import a real design
Support multiple conductor materials defined in one metal layer to meet microwave design requirements
Support a new port type defined as pin, mixed with both internal and edge lines
Support layout and measurement unit conversion
Support multiple layout formats import and export to cover RFIC, MMIC and LTCC applications , including *.iris, *.dwg, *.dxf, *.gds, *.brd/*.sip/*.mcm and so on
Support IRIS Plus export to HFSS and HFSS 3D Layout with tuned simulation settings to ensure accuracy as part of Xpeedic and Ansys software partnership