Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity plays an important role in the high speed channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity, but there are many defects in the traditional 3D full-wave simulation, for example, the model creation is complex and time-consuming. Hermes provides a fast and accurate way to simulate PCB board and package structure of signal integrity problems, such as insertion loss, return loss, crosstalk, etc., also allows the designer to simulate and track processing for post-layout.
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